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Infineon replaces IC card wirebonding with FCOS

Posted: 17 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:flip chip-on-substrate? ic card?

Chip-maker Infineon Technologies AG will be replacing its wirebonding process technology used in chip card manufacturing with flip chip-on-substrate (FCOS), which eliminates the use of wires and synthetic resin encapsulation.

"This year, we will have 30 percent of our modules employing FCOS and, in the next four to five years, we expect to discontinue wirebond completely," Director Peter Stampka confirms. The company asserted that the FCOS process allows their ICs to have more space for smaller modules and more functionality.

Infineon stated that it already produced 70 million FCOS telephone card modules in Mexico and has made the same profits with that of the wirebonds. The company will be introducing the technology to all of its facilities that process card chips. Infineon noted that 50 percent of its manufactured ICs were used in chip cards.

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