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Renesas, Symbian collaborate on 3G mobile phone platform

Posted: 17 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:symbian os? 3g mobile phones? rf front-end ic? rf power amplifier? software?

Renesas Technology Corp. and Symbian Ltd have entered into an agreement to add full-scale support for Symbian OS to Renesas' advanced silicon platform for 3G mobile phones.

Currently, Renesas and NTT Docomo are developing a single-chip LSI that combines a dual-mode (GSM/GPRS and W-CDMA) 3G baseband processor and an application processor for improved multimedia performance that is required in next-generation 3G handsets. The platform will also incorporate a modem function such as an RF front-end IC and RF power amplifier, and software such as a protocol stack, middleware, drivers and Symbian OS.

"By making the most of Renesas and Symbian's expertise in smartphone technology, Renesas will further accelerate the proliferation of Renesas' mobile platform into the 3G market," Ikuya Kawasaki, deputy general manager of system solution business unit 2 at Renesas.

"The Renesas 3G mobile platform will enable Symbian OS licensees to develop an even wider variety of smaller, differentiated, competitively priced Symbian OS phones that meet the specific needs of their network operator customers and help bring Symbian OS further into the mass market," said Morgan Gillis, EVP, Symbian.

The 3G mobile platform will be available in the second quarter of 2006, as well as production quantities of Renesas' dual-mode single chip LSI.

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