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Kyocera expands flip-chip assembly

Posted: 25 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:12-inch? 300mm? wafer dicing?

Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing. The new capability is expected to increase Kyocera America's wafer dicing capacity by 30 percent, improving throughput times and yields after dicing.

"We have added a 12-inch wafer dicing machine to support increased semiconductor trend towards 300mm wafer production," said Yasihiro Takai, general manager, assembly technology division. "It can be used on Si, SiGe and InP wafers, and will be especially helpful when working with semiconductor start-up companies that are going directly to 300mm technology."

In addition, Kyocera worked closely with Disco, the manufacturer of the machine, to develop a special wafer-cleaning feature.

The assembly technology division of Kyocera America offers art wirebond and flip-chip turnkey assembly services for prototype, quick turn, as well as volume, commercial and defense-grade requirements.

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