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New Pb-free nozzles are 40 percent wider

Posted: 04 Mar 2005 ?? ?Print Version ?Bookmark and Share

Keywords:speedline technologies? ultrafill? nozzle? wave soldering? vectra?

Speedline Technologies announced that it new UltraFill Pb-free nozzles feature an innovative technology and design to enable electronic manufacturers to overcome a variety of process challenges inherent in lead-free wave soldering.

"Soldering with lead-free alloys requires manufacturers to answer a host of new and formidable process challenges, ranging from slower wetting times to more viscous flow characteristics to higher temperatures," said Keith Howell, Wave Solder Product Manager. "Our new UltraFill nozzles provide the solution, and deliver both improved process performance and product quality."

The new UltraFill nozzles are 40 percent wider than traditional tin/lead nozzles to increase contact length and dwell time. These nozzles are also placed closer together to reduce the temperature drop between the nozzles so that less heat is needed to reflow solder joints in the second wave. As a result, Speedline said, the UltraFill nozzles deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.

A Nitrogen shroud is available as an option and allows for either air or nitrogen operation, as determined by the desired recipe without the need to change nozzles. The shroud both encompasses the nozzles in the pot and contains the dross in the solder pot, and lifts for easy maintenance and dedrossing without nozzle removal.

The new nozzles are available as an option on the Vectra and Electra wave soldering systems or as an upgrade to existing, installed equipment. The nozzles are compatible with the Omega wave and the Debridging Airknife.




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