Cadence, X-Fab to build design kits for analog, mixed-signal ICs

FAB Semiconductor Foundries AG has signed a collaborative agreement with Cadence Design Systems Inc. X-FAB will work closely with Cadence to build and deliver comprehensive design kits for analog and mixed-signal ICs targeting mainstream and advanced process technologies.

"The proliferation of consumer electronics, including wireless technology, has driven an increase in mixed-signal content within complex system-on-chips (SoCs)," said Jan Willis, SVP, industry alliances, at Cadence. "To address this increased complexity, design chain collaboration is critical to produce silicon-validated reference flows and process design kits (PDKs) that ease the challenges designers are facing. The combination of jointly developed PDKs with X-FAB and our proven analog and mixed-signal solutions enables mixed-signal chip designers to integrate more functionality onto a single chip."

Hans-Juergen Straub, CEO of X-FAB Group, added, "This alliance enables engineers using the Cadence Virtuoso custom design platform to have a smooth and efficient path from design through physical implementation. Our customers will benefit with faster time to market with lower risk and shorter design cycle times."

Moreover, fully qualified mixed-signal design kits, including physical verification runsets for Cadence's mixed-signal design flow, are offered through X-FAB's online service, X-TIC. PDKs from X-FAB are available for all offered technologies from 1.0?m down to 0.35?m, with voltage ranges from 1.0V up to 650V on CMOS and BiCMOS processes. Each process family has add-on modules which offer a variety of process combinations.