Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Alphasem rolls out 'ultimate tool' for die sorting

Posted: 11 Mar 2005 ?? ?Print Version ?Bookmark and Share

Keywords:easyline 8031t? tool? die sorting? carrier tape? surf tape?

Alphasem AG disclosed that its Easyline 8031T is the ultimate tool for die sorting into carrier tapes or onto surf tapes for subsequent processes like wafer level packaging (WLP), chip on board (COB) and flip chip on board (FCOB).

Based on a high-speed air bearing die pick and place system, this new tool provides superior placement accuracy, gentle die handling, 1m? footprint and unmatched productivity in the 150mm and 200mm market, said the press release. A closed loop linear motor pick head guarantees absolute synchronous die ejection without any needle marks on the die backside, and the EIA 481 compliant tape feeder with constant pressure sealing aligns the tape smoothly at placement position. In addition, the integrated post placement inspection and bad die remover ensures that the specified number of dice per lot is always processed. Dice can be placed either directly into a tape or flipped in the new die flipper, with the change over between flip/non-flip process done with a simple mouse click. Alphasem added that front access to all major systems simplifies operation.

The press release further said that the modular approach ensures later field upgradeability and ongoing flexibility to adapt to new processes. Available options are die flipper, post placement inspection, hot sealing unit and real time wafer map display.




Article Comments - Alphasem rolls out 'ultimate tool' f...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top