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Chip makers to build new fabs, R&D center at Hsinchu Science Park

Posted: 14 Mar 2005 ?? ?Print Version ?Bookmark and Share

Keywords:12-inch wafer? ic? powerchip semiconductor? vanguard international semiconductor?

IC makers Taiwan Semiconductor Mfg Co. (TSMC), Powerchip Semiconductor Corp. (PSC) and Vanguard International Semiconductor Corp. (VIS) announced their plans to construct new facilities and R&D center at the Hsinchu Science Park.

The Park's General Director James Lee says that the land is on the process of being purchased, with transactions expected to be completed by August.

The facilities will be located near the TSMC headquarters and will occupy an area of 300,000 square meters, but only 220,000 square meters will actually be available for construction. All the facilities are estimated to have a total investment of $9.7 billion.

TSMC states that it will be adding a 12-inch wafer fab and a 35nm R&D center at the park. PSC will construct a 12-inch fab, while VIS will build an 8-inch fab.





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