Tessera, Hynix sign package license agreement
Keywords:dram? hynix semiconductor?
Packaging IP supplier Tessera Technologies Inc. has signed a new technology licensing agreement with Korea-based DRAM supplier Hynix Semiconductor Inc.
The agreement covering chip-scale and multi-chip technologies from Tessera replaces a prior licensing agreement between the two companies.
Last month, Tessera filed a patent infringement suit against Hynix's rival memory suppliers Infineon Technologies AG and Micron Technology Inc., alleging the companies infringed on its memory package patents.
Tessera settled a package lawsuit with another memory supplier, Samsung, last November.
- Spencer Chin
EE Times
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