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Tessera, Hynix sign package license agreement

Posted: 07 Apr 2005 ?? ?Print Version ?Bookmark and Share

Keywords:dram? hynix semiconductor?

Packaging IP supplier Tessera Technologies Inc. has signed a new technology licensing agreement with Korea-based DRAM supplier Hynix Semiconductor Inc.

The agreement covering chip-scale and multi-chip technologies from Tessera replaces a prior licensing agreement between the two companies.

Last month, Tessera filed a patent infringement suit against Hynix's rival memory suppliers Infineon Technologies AG and Micron Technology Inc., alleging the companies infringed on its memory package patents.

Tessera settled a package lawsuit with another memory supplier, Samsung, last November.

- Spencer Chin

EE Times

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