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Infineon unveils high-density memory for mobile, graphics apps

Posted: 11 Apr 2005 ?? ?Print Version ?Bookmark and Share

Keywords:infineon technologies? memory? ddr2? so-dimm? small outline dual inline memory modules?

Seeking to increase its presence in the notebook and graphics markets, Infineon Technologies AG unleashed a number of high-density memory products last week.

Infineon is taking dead aim at the notebook market, where sales are expected to grow an average of 13 percent through 2006, reaching 52.2 million units, according to market research firm iSuppli.

For high-end notebooks, Infineon released engineering samples of 2GB dual-die based DDR2 SO-DIMMs (Small Outline Dual Inline Memory Modules), which achieve the 2GB capacity using a form factor thickness of 3.8mm.

According to the company, the DDR2 part's dual die components have the industry's lowest measured power consumption, which decreases working power consumption by 30 percent and improves thermal efficiency by roughly the same amount.

Infineon also introduced 1GB versions of its DDR2 Micro-DIMM line for subnotebook computers. The Micro-DIMMs use a 214-pin mezzanine connector technique that reduces the module's size and the area covered by the connector by about 35 percent, said the company.

The 1GB DDR2 Micro-DIMMs are based on 8 single-die 1Gbit DDR2 components. Samples are now available for speeds of PC2-3200 and PC2-4300.

Infineon also expanded its graphics memory portfolio to include 512Mb GDDR3 (Graphics Double Data Rate 3) memory with the increased density and bandwith needed for advanced 3D- graphics. The GDDR3 16Mb x 32 components have a clock frequency of 800MHz, enabling data bandwidths of up to 51.2Gbps per memory.

The GDDR3 provides clock frequencies of up to 800MHz at an operating voltage of 1.9V. The package is a JEDEC compliant 136-ball FBGA package with 11-by-14-by-1.2mm dimensions. Samples are shipping now.

- Spencer Chin

EE Times




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