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Standards may move inside the process chamber, says Intel's Gargini

Posted: 14 Apr 2005 ?? ?Print Version ?Bookmark and Share

Keywords:450mm diameter wafer? international technology roadmap? semiconductors?

Paolo Gargini, Intel Fellow and chairman of the International Technology Roadmap for Semiconductors organization, said that standardization may have to go much further than in the past to allow nanotechnology to be developed on 450mm diameter wafers.

During a question and answer session at the opening press conference of the Semicon Europa exhibition here Gargini was asked whether nanotechnology would acquire the discipline of standardization that had allowed semiconductor microelectronics to flourish.

"Can nanotechnology follow the same rules as semiconductor manufacturing?" he was asked. Gargini had already made that if the definition of nanotechnology was structures below 100-nanometers in critical dimensions Intel had been shipping nanotechnology for a number of years.

"Let's look at 300mm wafer processing. Standardization helps automation and diminish labor costs down below 10 percent. At 450mm we can re-open the discussion on standardization. At 300mm we standardized the interfaces. At 450mm we need to standardize other aspects of manufacturing, even inside the process chamber, so that we can concentrate on adding value in design."

- Peter Clarke

EE Times

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