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Honeywell offers wafer thinning materials for semiconductor production

Posted: 15 Apr 2005 ?? ?Print Version ?Bookmark and Share

Keywords:wafer thinning materials? high-powered chips? thermal management material?

Honeywell has announced the availability of wafer thinning materials as part of its product portfolio for semiconductor manufacturing. The materials will be produced at the company's new electronic materials manufacturing site in Chandler, Arizona, which opened in February of this year, as well as at Honeywell's Seelze, Germany facility.

Semiconductor manufacturers are continually seeking ways to dissipate the tremendous heat produced by today's high-powered chips. Wafer thinning materials allow chips to function at higher speeds since the insulating silicon between the device and thermal management material is reduced.

The wafer thinning materials are the first new product line from the Chandler facility. With the opening of the Chandler site, Honeywell maintains three of the newest electronic chemical facilities in the United States and boosted its capabilities to supply both straight and advanced, customized electronic chemicals for the semiconductor industry.

In addition to wafer thinning materials, the company will be producing other advanced wet chemicals. These solutions represent Honeywell's commitment to providing customized, application-specific product offerings to its customers.

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