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New mask metrology tool supports 65nm and beyond

Posted: 22 Apr 2005 ?? ?Print Version ?Bookmark and Share

Keywords:leica Microsystems? mask metrology tool? lms ipro3? semicon europa 2005? 65nm technology?

During this week's Semicon Europa 2005, Leica Microsystems has unveiled its new mask metrology tool Leica LMS IPRO3 that is designed to support mask metrology for the 65nm technology node and beyond.

Compared to the previous tool generation LMS IPRO2, this new high end device provides a significantly improved measurement precision with a short term repeatability of better than 1.5nm, said the press release. Just as its precursors, the LMS IPRO3 will support the demanding metrology needs of semiconductor mask manufacturers and their customers.

The design of the LMS IPRO3 combines maximum throughput with minimum programming time and operator interference. All measurement jobs can be prepared and learned on- or offline. A further approved characteristic is its unique data evaluation software package DEVA which remains an integral part of Leica Microsystems' LMS IPRO metrology solution, added the company. It automates the statistical analysis of the gathered data and allows the user to define data evaluation macros. Due to its networking capability, operators and engineers can remotely operate the system and evaluate the results.



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