TSMC to get wafer bumping service from STATS

Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.

STATS explains that using consigned equipment, the electroplating bumping technique is suited for fine-pitch flip chip applications as it provides bump quality, higher yield, finer bump pitches and higher temperature resistance.

Scott Jewler, chief strategy officer, STATS ChipPAC, commented, "Flip chip is important for applications with intense performance demands and space constraints such as graphics, chipsets, digital signal processors (DSPs), radio frequency (RF), analog and power management. Our goal is to broaden our advanced flip chip services portfolio and offer volume manufacturing by third quarter of this year."