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ST, Octasic deliver VoP telecom ICs

Posted: 13 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:voice-over-packet? telecom ics? vop?

STMicroelectronics and Octasic Inc. have signed an agreement to deliver a family of Voice-over-Packet (VoP) telecom ICs. The first ICs developed under this agreement will be based on ST's 0.13?m and 90nm semiconductor process technology and Octasic's designs for VoP and Voice Quality Enhancement (VQE), which includes technology for line and acoustic echo cancellation, noise reduction capabilities, vocoding and packetization.

According to the companies, the first IC of the family will be available in Q205. The agreement also provides for the development of future SoC VoP devices which will be implemented in 90nm and below process technologies.

Daniel Abecassis, group VP, general manager of the wireless infrastructure division of ST, said, "The two companies will be able to leverage each other's expertise to design and produce leading-edge products for top tier telecom customers."

"Together with ST, we will be able to design fully optimized devices in the latest silicon technology with high performance and low power consumption, perfectly matching customer needs," stated Michel Laurence, CEO of Octasic. "This agreement will enable us to offer great assurance of supply and support to our customers and provide Octasic with the stability and technical competence to take our future devices to a whole new level," Laurence added.

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