Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Memory/Storage

3D Plus introduces a 3Gb radiation-tolerant SRAM

Posted: 13 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:3d plus? memory module? sram? fpga? intelligent memory module?

3D Plus is introducing a commercial-off-the-shelf radiation tolerant memory module, suitable for space applications such as commercial or scientific geo-stationary missions and deep space scientific exploration.

By using SRAM-based FPGAs, the Intelligent Memory Module will take advantage of the ability to change function, and the substantial data processing performance. The module provides a 3Gbit memory capacity, including a TMR memory controller for multiple error correction. This controller is implemented into the XQ2V1000 SRAM-based FPGA from Xilinx Virtex-II family.

The default Intelligent Memory Module Configuration is programmed in the factory into the FPGA configuration PROM. Moreover, the modular architecture, the SRAM-based FPGA re-programmability and the large amount of SDRAM allow an implementation of custom specific application, such as image data processing, high speed network switching/monitoring and other embedded applications. The Intelligent Memory Module was developed under NASA Contract : NAS1-03064. It operates of a single 3.3V power supply.

- Henri Arnold
Electronics Express Europe

Article Comments - 3D Plus introduces a 3Gb radiation-t...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top