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STATS ChipPAC to offer 300mm electroplated wafer bumping services

Posted: 17 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:stats chippac? electroplated wafer bumping service? wafer? electroplating?

STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications. Additionally, the company disclosed that it has expanded solder alloy choices for its current flip chip offering and enriched its design, simulation and characterization capabilities for high end flip chip packages.

Flip chip is an emerging interconnect technology that provides a cost effective solution for applications requiring a smaller form factor, higher input/output (I/O) and enhanced thermal and electrical performance.

STATS ChipPAC's Flip Chip packaging configurations include Ball Grid Array (BGA), Chip Scale Packages (CSP), Land Grid Array (LGA), Quad Flat No Lead (QFN), Wafer Level CSP (WLCSP) and System-in-Package (SiP) modules, as well as next generation three dimensional (3D) packages.

According to the press release, electroplated wafer bumping technology is key to achieving superior bump quality, higher yield and finer bump pitches over other wafer bumping methods. "Electroplated wafer bumping provides significant advantages to our customers in terms of technology, performance and quality and was a critical piece of our strategic plan to offer a comprehensive turnkey service offering for advanced flip chip applications in the second half of 2005," said Han Byung Joon, CTO of STATS ChipPAC. "We have also expanded our solder alloy choices as well as design and characterization capabilities for advanced flip chip packages."

The 300mm wafer bumping services will be located in Taiwan in close proximity to the company's existing 300mm bumped wafer sort services and to industry leading foundries. The new 300mm wafer bumping capability complements STATS ChipPAC's current capability which comprises low cost printed wafer bumping on 200mm wafers with redistribution (RDL) and repassivation. The company has also added ultra low alpha Hi Pb composition to its standard offering of Eutectic and Pb-free. The addition of Hi Pb alloy is particularly important to semiconductor companies with devices requiring high temperature stability, very high reliability and resistance to electromigration.

"Over the last six months, STATS ChipPAC has focused on aggressively expanding its flip chip portfolio. This is important not only in terms of addressing the industry migration from wire bonding to flip chip interconnect, but also serves as a strategic enabler for our 3D initiative," commented Scott Jewler, the company's Chief Strategy Officer. "With our new electroplated bumping capabilities, flip chip interconnect and expanded design and simulation capabilities, we can combine our advanced flip chip and wire bond technologies in complex 'hybrid' solutions such as stacked die and stacked packages for DSP, memory and analog devices for the handset markets."




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