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Discrete devices sport new packaging platform

Posted: 19 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:diodes? dfn packaging platform? packaging platform\?

After nearly three years in development, Diodes has launched its DFN packaging platform with a new line of discrete devices. The packaging platform uses an advanced leadless quad flat no-lead (QFN) technology that gives it the highest power density over any SOD and SOT package.

"The DFN packaging platform offers dramatically smaller and lower profile dimensions approaching die scale, while simultaneously extending power dissipation up to twice as much as the larger leaded SOD and SOT type packages currently on the market," said Mark King, VP of sales and marketing at Diodes.

Its power density is nearly 325mW/mm? compared with 30mW/mm? for a SOT-23 package and 65mW/mm? for a SOD-123 package. Its height measures 0.53mm compared with 1.1mm and 1.35mm for SOT-23 and SOD-123 packages, respectively. And it offers an ultra compact footprint of 0.77mm? of PCB area as compared to 9.9mm? for SOT 23 and 7.6mm for SOD-123.

"Its extremely small size and low profile package height make it the thinnest discrete packaging technology available," King said. "Leadless contact pads ensure good co-planarity during PCB soldering processes, increasing soldering efficiency."

King also explained that contact pads also allow for maximum die size within a given package footprint and a higher package power-density than other leaded subminiature available on the market today. The DFN package, for example, takes up only 40% of the PCB area that the sub-miniature SOD-523 package requires.

The DFN 1006-2 and DFN 1006-3 packages are available for two-and three-pin devices, respectively. The company is developing six and eight-pin QFN platforms for arrays that it says will be available in the future.

Diodes is offering many of its discrete devices with the DFN packaging platform, including four Schottky diodes and its Zener diodes series from 5.6V to 24V. It also has plans to package its switching diodes and NPN/PNP transistors using the leadless QFN packaging technology.

The leadless package design helps the devices transfer heat more efficiently. As a result, the Schottky diodes and Zener diodes are able to dissipate 250wW of power, significantly more than other larger surface-mount devices, the company said.

King also mentioned that a flexible manufacturing process allows packages to be quickly and easily changed.

"Package dimensions, pad count and pad dimensions can be adjusted easily without requiring expensive or time-consuming production equipment modifications," he said.

There are several market sectors driving the need for ultra-miniature discrete devices and arrays in very small packages.

One in particular is consumer electronics, specifically mobile phones, compact portables such as MP3 players, digital still cameras and notebook computers. King also said that the automotive sector is starting to demand these types of devices as "density and complexity requirements become more critical."

The package does carry a 30% premium over standard packaging methods, King said.

The Schottky solutions that are housed in the new DFN packaging are the BAS40LP, BAT54LP, SDM10U45LP and SDM20U30LP. The Zener Diode part numbers are the BZT52C5V6LP, BZT52C6V2LP, BZT52C6V8LP, BZT52C7V5LP, BZT52C8V2LP, BZT52C9V1LP, BZT52C10LP, BZT52C11LP, BZT52C12LP, BZT52C13LP, BZT52C15LP, BZT52C16LP, BZT52C18LP, BZT52C20LP, BZT52C22LP and BZT52C24LP.

- Ismini Scouras


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