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Tessera signs substrate pact with Japanese board company

Posted: 20 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:pc board? electronics? north?

Tessera Technologies Inc. announced that it would expand a business and technology relationship with Japanese pc board technology supplier North Corp. to develop and make available advanced substrate technologies for next-generation electronics.

Tessera has formed a wholly-owned subsidiary to acquire the ownership of certain technologies that have been developed in cooperation with North along with the associated licensing rights.

North licenses technologies used to manufacture high-density, multi-layer printed writing boards that can also be applied to advanced semiconductor package substrates. The transaction is expected to close in late May.

"The substrate technology we've developed with North can be utilized in a broad range of packaging applications to significantly improve performance, functionality and density, while also reducing cost," said Bruce McWilliams, Tessera's chairman and chief executive, in a statement.

- EE Times





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