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IBM, Toppan sign $200 million photomask agreement

Posted: 23 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:45nm photomasks? toppan printing? 300mm wafer?

IBM Corp. and Toppan Printing Co. Ltd have signed a joint development agreement covering 45nm photomasks worth $200 million, IBM said.

The development work is set to be conducted at IBM's Burlington, Vermont facility and evaluated at IBM's 300mm wafer fab in East Fishkill, New York. Toppan has agreed to assign engineers to work with IBM's mask development team in Burlington.

The companies did not say over what time period the money would be spent or how much each would invest in the project but the two companies have set a goal of developing 45-nm photomasks that would be ready for production around mid-2007.

Toppan plans to transfer the jointly developed manufacturing process from IBM's Burlington operation to its own plants, and to establish a production system to provide customers with 45-nm photomasks for the early stages of commercialization.

With this joint photomask development initiative, industry-wide R&D efforts for commercial production of 45nm technology is likely to accelerate, IBM said.

"IBM and Toppan will bring together formidable skills and resources to create an industry-leading 45-nanometer photomask technology," said Douglas Grose, general manager for technology development and manufacturing at IBM, in a statement.

"The expertise accumulated in cooperation with IBM will help Toppan maintain its position as the world's top photomask manufacturer, even at the 45nm process node," said Naoki Adachi, president of Toppan, in the same statement.

- Peter Clarke

EE Times

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