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Aeluros makes 'green' versions

Posted: 15 Jun 2005 ?? ?Print Version ?Bookmark and Share

Keywords:aeluros? puma? physical layer ic? ael1001? ael1004?

The industry is continuing to see green. Green and Pb-free devices that is, as more and more companies roll out environment-friendly versions of its product offerings. One such company is Aeluros. This fabless semiconductor company recently announced green variants of its Puma 10Gbps physical layer IC devices.

"By providing green products well in advance of the RoHS implementation requirement of July 1, 2006, we have allowed customers to design their optical modules and subsystems to be green today, and to avoid the need for costly re-qualification efforts later," said Nader Gamini, VP of manufacturing. "Aeluros' focus on low-cost, mainstream technologies such as CMOS process technology and wirebond plastic BGA packaging, and our close relationships with our suppliers have helped facilitate the availability of our green products."

Aeluros' green products are compliant with industry-standard Pb-free solder profiles for ease of manufacturing, and have been fully qualified using JEDEC-standard procedures. This includes a robust suite of solderability, high temperature storage, HAST, temperature cycle, and MSL testing. Green products from Aeluros are also fully pin- and performance-compatible with standard products, enabling a smooth, low-risk transition for both existing and new customers.

Puma family

The Puma product family consists of 10Gbps-to-XAUI physical layer solutions for numerous applications within 10GbE and 10Gb Fiber Channel markets. Aeluros said the AEL1001 device provides the industry's lowest-power solution for XENPAK, X2 or XPAK optical modules, and incorporates an integrated limiting amplifier for reduced module cost. Meanwhile, the AEL1004 provides a WAN/LAN implementation for optical modules through the integration of the IEEE 802.3ae-defined WAN Interface Sublayer (WIS) for Ethernet operation across SONET/SDH networks. The AEL1002 provides a XFI-compliant 10Gbps interface for implementation of a XAUI-to-XFI bridge function for 10Gbps line cards or NICs developed using the XFP optical module form factor.

The AEL1001, AEL1004 and AEL1002 devices are built using generic 0.13?m CMOS process technologies and generic wire-bond plastic BGA packaging. The products incorporate register sets appropriate to the XENPAK and XFP MSAs, IEEE 802.3ae standard and end-customer-specific specifications. All three devices are pin-compatible in a 144-pin, 13-by-13mm plastic, wirebond BGA package, and have been thoroughly verified in a range of end-system environments.




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