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Winbond to ramp up 300mm production using ESI Model 9830

Posted: 17 Jun 2005 ?? ?Print Version ?Bookmark and Share

Keywords:esi model 9830? semiconductor link? processing systems? electro scientific industries? 300mm?

Winbond Electronics Corp. has purchased multiple ESI Model 9830 semiconductor link processing systems from Electro Scientific Industries Inc. to be installed at its latest 300mm fab in Taichung, Taiwan. The processing systems will be used to ramp production of high-performance memory chips. The shipments will begin in ESI's first fiscal quarter.

Fang, assistant VP, facility & testing center at Winbond, said, "Due to the success of our existing 9350 and 9820 systems combined with the results of an extensive evaluation of vendors, we determined that ESI provides the highest-value manufacturing solution and has the greatest ability to accommodate our stringent 300mm manufacturing requirements for our new Taichung fab. We look forward to deploying the 9830 systems to help ensure a rapid production ramp at our 300mm fab."

ESI's Model 9830 is specifically designed to boost yields for DRAMs, SRAMs, embedded memory devices and other laser-fuse applications on 90nm and 70nm semiconductor memory designs. The Model 9830 also includes innovative optics and beam positioning designs, which deliver capabilities for processing next-generation 512Mb and 1Gb DRAM device designs.

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