Winbond 300mm production adopts VIISta implanters

Taiwan-based Winbond Electronics Corp. has purchased VIISta single wafer ion implanters from Varian Semiconductor Equipment Associates Inc. Winbond has used the tools in its 300mm production. The shipment of platform tools consist of VIISta HC high current, IISta 810XE medium current and VIISta 3000HP high energy ion implanters.

Winbond selected Varian Semiconductor due to its market position in single wafer ion implanters and the cost of ownership benefits associated with a complete platform of VIISta products. Victor Wang, 300mm Fab director of Winbond, said, "Varian Semiconductor's single wafer ion implanters provide us with a flexible manufacturing solution to meet our advanced production requirements. We selected an all-single wafer solution because they are inherently cleaner and offer greater process flexibility. With the single wafer VIISta platform, we are able to reduce the overall number of ion implanters and lower our capital costs, while maintaining high productivity over a broad range of applications."

The VIISta products make up the only production-proven single wafer platform of ion implanters in the industry. All of the VIISta products feature the Varian Control System (VCS), the Varian Positioning System (VPS) and a common single wafer endstation. The high degree of commonality across the VIISta platform eases integration into factory automation, lowers spare parts and training costs, and simplifies tool operation.