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Stacked package from Sharp allows 0.5-mm grid

Posted: 23 Jun 2005 ?? ?Print Version ?Bookmark and Share

Keywords:0.5mm pitch ball grids? 3d-sip? system-in-package?

Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.

Presently, two types of three-dimensional system-in-package (3D-SiP) technologies exist. One is a stacked chip-scale package technology which stacks chips into a single package. The other stacks pre-tested LSI packages into a single package.

"It was especially difficult to make the ball pitch finer for the upper package to secure enough height for the chip mounted on the lower package," said a Sharp spokesman. He added that narrowing the pitch forces the ball to shrink, leaving insufficient space for the chip on the base substrate.

Competitors' ball pitches are typically 0.65 or 0.8mm, according to the spokesman.

Sharp's stacked package solution measures 14mm x 14mm, or 42 percent less space than an equivalent dual-package solution comprising a DSP package and a multi-stack memory package.

The package mounts a DSP on the base substrate at a 0.25mm height which just fits in the space made by the 0.5mm pitch ball grid array of the upper package. The lower package that mounts the chip is 0.7mm high.

The upper package, integrating one 32Mb flash memory and one or two 256Mb SRAMs is 1.25mm high. With a 0.25mm overlap between the packages, the package's total height is 1.7mm.

Sharp will offer the package for digital still camera applications handling inputs from 3- to 10-megapixel image sensors.

The chips are dubbed as LR38683 (two SRAMs) and LR38682 (one SRAM). Samples will be available this month at $77 and $54 respectively. Volume production begins in July.

Sharp intends to eventually leverage the stacked package technology to develop a single-package solution combining a baseband LSI package and a memory package for mobile phones, according to a spokesman.

- Yoshiko Hara

EE Times





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