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IC packaging and testing companies expect high revenues in Q3

Posted: 08 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ic packaging? testing?

Most IC packaging and testing companies in Taiwan are anticipating significantly higher revenues in the second half of the year, as increasing demand has shown signs of market potential in June.

According to substrate makers Phoenix Precision Technology Corp. (PPT) and Kinsus Interconnect Technology Corp., companies have placed orders well until this quarter and lead times for flip-chip substrates and PBGAs were prolonged to at least 10 weeks more due to demand boosts in May.

PPT expects its June revenues to reach more than NT$800 million ($25 million at NT$31.67:$1) and expects its monthly revenues to even hike up further to NT$1 billion ($31 million) this quarter.

Kinsus may likewise surpass its May revenues of NT$514 million ($16 million) and expects to have monthly revenues of NT$600 million ($18.9 million) this quarter.

Memory testers Powertech Technology Inc. and ThaiLin Semiconductor Corp. are also expecting higher revenues in this quarter. Powertech already acquired five more testers as demand for DDR2 pushed up and makers negotiate for longer lead times.

Powertech expect its monthly revenues to reach NT$1 billion ($31 million) while ThaiLin projects quarterly revenues to reach at least NT$480 million ($15.1 million) this quarter and NT$500 million ($15.8) in the last quarter of the year.

Packaging and driver IC testing companies Siliconware Precision Ind. Ltd. (SPIL) and Chipbond Technology Corp. also expects new record for its revenues this quarter. SPIL says it expects to run at full capacity this month until August while Chipbond expects 40 percent revenue growth in the second quarter.





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