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DDI chip reduces interconnection wires

Posted: 12 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:samsung electronics? qvga display driver ic? ddi chip? qualcomm? s6d0142?

This DDI chip is more reliable due to a simplified designSamsung Electronics Co. Ltd disclosed it has developed an optimized QVGA display driver IC (DDI) chip that incorporates QUALCOMM's Mobile Display Digital Interface (MDDI). By including this serial interface technology, Samsung said, its new S6D0142 DDI chip reduces the number of wires that run across the hinge of wireless 3G clamshell handset designs to interconnect QUALCOMM Mobile Station Modem (MSM) chipsets with the LCD display. Mobile handsets with the S6D0142 DDI chip will also be more reliable due to a simplified design, added Samsung.

The MDDI standard, a high-speed serial interconnection technology developed by QUALCOMM, promises to increase reliability and reduce power consumption in clamshell and slide mobile phones by greatly decreasing the number of wires.

"With mobile devices supporting a variety of value-added multimedia functions and delivering an increased amount of data, the need for high-speed serial interface is on the rise," said Jin-tae Kim, VP of Display Driver Development Team at Samsung Electronics' System LSI Division. "At the same time, the actual size of mobile devices is decreasing. We've taken the next step in the evolution of MDDI enabled ICs."

In addition to the built-in MDDI display interface, the S6D0142 chip incorporates a timing controller, a source driver, a gate driver, a power supply IC, and 1.3Mb of SRAM. It will be available for select customers by Q3 2005, and to worldwide manufacturers by Q4 2005.

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