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Ka-band PAs and doubler target wireless communications apps

Posted: 15 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:mimix broadband? gallium arsenide? gaas? monolithic microwave integrated circuit? mmic?

Mimix Broadband Inc. introduced a new line of Ka-band gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) products, including power amplifiers and a doubler, covering the 27GHz to 34GHz frequency bands. The new power amplifiers and doubler use 0.15?m gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology.

Operating across 27GHz to 33GHz, the model 30SPA0536 PA delivers 36dBm saturated output power with 21dB gain and 1dB gain flatness while drawing 2.1mA at 5Vdc. Operating from 28GHz to 31GHz, model 30MPA0562 PA delivers 30dBm saturated output power with 27dB gain. Model 30SPA0557 operates across 27GHz to 32GHz, delivers 34dBm saturated output power and 21dB gain.

Model 30DBL0537 is an active doubler that accepts 14.5GHz to 17GHz RF input, and is specified for 2dBm input power, 20dBm output power, and draws 190mA from a 5Vdc supply.

When used in conjunction with the 30SPA0536, the 30DBL0537 provides a solution for highly integrated uplinks for commercial and defense applications, eliminating the need for a more complex heterodyne up-converter system design. The new amplifiers and doubler are well suited for wireless communications applications, such as millimeter-wave point-to-point radio, LMDS, Satcom and VSAT applications.

"These parts provide 'state-of-the-art' power levels at the Ka-band frequencies used for satellite uplinks, with good PAE and match, and exceptionally good lifetime, in 4-mil substrate thickness that facilitates handling at the die level," stated Dr. Jim Harvey, CTO of Mimix. "In addition to providing these parts as die, Mimix is developing a range of packaged versions to facilitate low cost manufacture of Ka-band up-converters."

Mimix performs 100 percent on-wafer RF, DC and output power testing on these products, as well as 100 percent visual inspection to MIL-STD-883 method 2010. The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Samples are already available, with production quantities available in 6 to 8 weeks.

- Janine Love


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