Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

Assembling high-lead (Pb) DS2502 flip-chips in a Pb-free assembly flow

Posted: 08 Jun 2005 ?? ?Print Version ?Bookmark and Share

Keywords:pb-free? ds2502? flip-chip?

This app note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly.

View the PDF document for more information.

Article Comments - Assembling high-lead (Pb) DS2502 fli...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top