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Samsung, Staktek expand IP license agreement

Posted: 20 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:dram? staktek? sram? flash memory?

Samsung Electronics Co. Ltd and Staktek Holdings Inc., a provider of intellectual property and services for the next generation of 3D high-speed and high-capacity thermal management systems, have extended their license agreement in July 2000 for stacking packaged DRAMs using Staktek's stacking technology.

Under the terms of the expanded agreement, Samsung will be able to use Staktek's leaded package stacking technology for any Samsung leaded device, such as DRAMs, SRAMs and flash memory, until 2010.

Staktek President Wayne R. Lieberman said that the agreement enhances Samsung's ability to lead the market in next-generation, high-capacity solutions across multiple memory formats.

Samsung will continue to lead the way in attaining the highest density modules afforded by smaller geometries and accompanying manufacturing refinements, stated Jun-Young Jeon, VP of Memory product planning and application engineering at Samsung Electronics.

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