Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

K&S, Microbonds form bonder alliance

Posted: 26 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:wire bonders? interconnect? ic?

Kulicke & Soffa Ind. Inc. and Microbonds Inc. announced a joint process development project. The deal will align the technological roadmaps of Microbonds' new insulated gold wire bonding products and K&S' wire bonders.

Microbonds' technology, dubbed X-Wire Technology, "addresses many of the difficult interconnect challenges arising from the increasingly complex single and stacked die packaging designs associated with the decreasing geometries and increasing performance capabilities of today's advanced ICs," according to the companies.

Christian Rheault, K&S vice president of ball bonders, said the technology has several advantages. "The potential to shrink package size, increase performance, reduce costs and enhance reliability using Microbonds' X-Wire Technology within the established wire bonding assembly environment is a very intriguing development that we are delighted to support for the benefit of our customers and the industry," he said in a statement.

K&S' rival in the bonder business also has a similar deal. ASM Pacific Technology Ltd. and Microbonds recently formed a strategic alliance to enable a new wire-bond packaging technique, dubbed X-Wire Technology.

- Mark LaPedus

EE Times

Article Comments - K&S, Microbonds form bonder alliance
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top