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Heatsinks designed for BGAs

Posted: 28 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:vette? thermal solution? ball grid array? bga? heatsink?

Thermal solutions for ICs in BGA packagingVette Corp. has announced the availability of its thermal solutions for ICs in ball grid array (BGA) packaging. The new BGA heatsinks target traditional high-volume motherboard, video card and networking board applications.

The company provides both standard and custom-branded thermal solutions for BGAs. Low-end customization includes customer-selected attachment, interface material and fan selections. Other customization services include cosmetic and structural modifications to the heatsink as well as labeling and graphic treatments.

Vette also supports an emerging market for BGAs in more visible applications in personal computers and consumer electronics with high-end design optimization to meet thermal performance requirements and branding purposes such as to reflect corporate or brand images for OEM customers.

The company supports existing OEM designs integrating BGA packages with thermal solution graphic and mechanical design services, thermal analysis, mechanical analysis, thermal testing, and fan life testing. For customers in early phase design, Vette offers access to design-engineering personnel, test facilities and complete prototyping capabilities to ensure rapid design cycles.

Pricing for standard BGA thermal solutions starts at 40 cents in volume with a delivery as short as two weeks.

- Gina Roos
eeProductCenter




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