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Leica system cuts ownership cost of semiconductor manufacturers

Posted: 29 Jul 2005 ?? ?Print Version ?Bookmark and Share

Keywords:leica Microsystems? lds3300 c? fab?

The new LDS3300 C from Leica Microsystems complements its LDS series by an innovative system, combining micro and macro defect detection at simultaneous use for all 300mm wafer applications.

According to the press release, the macro module of the Leica LDS3300 C system automatically captures a full color image of the entire wafer surface. This image is compared by either die to die as well as die to reference information. Differences are considered as defects and will be compared to an image library of known classified defect groups. Based on this automatic defect classification, the system individually decides further steps such as Go, No Go, Inline Microscopic Review, Alarm, etc.

"Conceived for perfect integration into automated fab lines, our new system combines micro and macro defect detection for all 300mm wafer applications," said Thomas Breser, Strategic Marketing & Communications Director at Leica. As a key part of the automated macro inspection process at a customer's fab, the LDS3300 C provides automated reticle and fuse inspection capabilities. In addition, the system's high throughput (up to 130 wafers per our) helps increase overall fab yields and, ultimately, reduces cost of ownership for the manufacturer.

The company disclosed that they have already delivered two systems to the North American fab of a major semiconductor manufacturer, with the transaction valued at more than 2.5 million Euros.

"In addition to the technology of combining automated macro inspection with an inline microscope module, improving productivity is a crucial factor in the semiconductor industry," said LDS3300 product manager Thomas Groos. "This is also why our new system is currently being evaluated by further well-known manufacturers. We fully expect to win numerous additional orders this year."



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