Agilent, Speedline partner on lead-free research experiments

Agilent Technologies Inc. and Speedline Technologies Inc. are collaborating in the lead-free process development and characterization of printed circuit board assemblies (PCBAs).

Speedline, a maker of capital equipment for electronics-manufacture process solutions, will use Agilent's lead-free-ready inspection systems in a series of experiments to document best practices associated with the transition to lead-free manufacturing.

Agilent provides lead-free inspection solutions, including the Medalist SP50 Series II Solder Paste Inspection (SPI) and the Medalist SJ50 Series II automated optical inspection (AOI).

According to Agilent and Speedline, effective monitoring and process control in the solder steps are required to reduce defects, maintain desired yield and lower costs. Planned experiments include investigating and documenting the effect of various process aspects of the lead-free transition. With Agilent's AOI verification of paste and component placements, the results will establish critical, lead-free process recommendations to be leveraged industry-wide for quick process optimization.

Results will be presented as articles and professional papers, beginning at the Surface Mount Technology Association International (SMTAi) conference next month.