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Sanmina-SCI licenses Buried Capacitance to ISU Petasys

Posted: 15 Aug 2005 ?? ?Print Version ?Bookmark and Share

Keywords:buried capacitance? multilayer pcb emi?

Sanmina-SCI Corp. has entered into a licensing agreement with ISU Petasys Corp. to manufacture multilayer PCBs using Sanmina-SCI's patented Buried Capacitance (BC) technology.

According to the licensing agreement, ISU Petasys will implement the technology at its manufacturing facilities in Sylmar, California and Daegu, South Korea.

The benefits of using BC technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interference (EMI) and in a quieter power distribution system. Even more, BC potentially reduces many bypass capacitors from the surface of a PCB, which equates to assembly cost reductions and increases the available surface area for increased circuit-routing density.

In support of this, the license offers access to a variety of BC materials in the 0- to 4-mil dielectric thickness range, including Oak-Mitsui Technology's FaradFlex line of 1-mil and sub 1-mil dielectrics.

Sang Kim, president of ISU Petasys believes the agreement will enable the company to serve the technology needs of its customers today and in the future.

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