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Japan's fab-tool book-to-bill stays above parity

Posted: 22 Aug 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ic design tools? fab tool? semiconductor production equipment?

Japanese semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.08 for July according to the Semiconductor Equipment Association of Japan. This was essentially flat with a book-to-bill ratio posted for June 2005 of 1.09.

June was the first time the ration had been above parity since December 2004.

The Japanese equipment makers posted 112.84 billion yen (about $1.02 billion) in orders in July 2005 as a three-month average of May, June and July orders. The bookings figure is 5.7 percent up the final June 2005 level of 106.77 billion yen (about $967.2 million) and 28.3 percent down on the 157.35 billion yen in orders posted in July 2004.

The three-month average of worldwide billings in July 2005 was 104.71 billion yen (about $948.5 million). The billings figure is 7.0 percent up on the final June 2005 level of 97.90 billion yen (about $886.6 million) 25.9 percent down the July 2004 billings level.

- Spencer Chin

EE Times

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