Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Interface

Surface-mount IDC terminal replaces through-hole version

Posted: 24 Aug 2005 ?? ?Print Version ?Bookmark and Share

Keywords:edac? idc terminal?

EDAC (Europe) Ltd has developed a new surface-mount technology IDC terminal to replace a through-hole soldered wire joint, resulting in significant cost savings particularly for miniature PC-boards used in automotive applications, said the company.

This new press-in wire IDC contact design, which is fitted to a single-sided SMT PC-board, replaces the traditional method of stripping, tinning and soldering into a through-plated hole. As a result, the new SMT version provides a significant savings on PC-board cost, and time associated with stripping, tinning and terminating discrete wires, said the company. It also eliminates concerns for wire breakage at the solder joint shoulder, when bent through 90.

The SMT IDC terminal is plated with pure matte tin and fully complies with RoHS requirements. It can be reflowed at 260C.

Pricing starts at 7 cents for pre-production quantities.

- Gina Roos


Article Comments - Surface-mount IDC terminal replaces ...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top