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Toshiba mulls 300mm expansion plan

Posted: 24 Aug 2005 ?? ?Print Version ?Bookmark and Share

Keywords:300mm wafer?

Japan's Toshiba Corp. is considering a plan to spend around $4.2 billion to expand its 300mm wafer production by 150 percent in the 2008 time frame, according to reports.

The output will be used for the company's memory chips. It is also expected to boost Toshiba's bottom line, as the company projects that its semiconductor sales, including flash memory chips, will reach 1.2 trillion yen ($10.94 billion) in the year ending March 2008.

Recently, Toshiba said that it is planning to target 50 percent of its capital expenditure over the next three years on increasing semiconductor production, the company's incoming president Atsutoshi Nishida said, unveiling the group's three year plan. This implies expenditure of 550 billion yen ($5 billion), and a target of increasing semiconductor sales 8 percent over the next three years (see August 10 story).

Anticipating soaring demand for NAND flash memory, Toshiba also said it will boost investment in its memory fab in Yokkaichi, increasing capacity to 30,000 300mm wafers a month, or 40 percent more than previously planned (see July 29 story).

- EE Times





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