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LSI Logic's platform ASIC validates TTPCom 3G modem

Posted: 14 Sep 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ttpcom? cellular baseband macro 3g? cbemacro 3g? baseband? 8.3mbits?

LSI Logic Corp.'s RapidChip Integrator2 platform has been selected by U.K.-based TTPCom for its next-generation 3G cellular modem technology, named Cellular Baseband Macro 3G. The CBEmacro 3G, is a complete IP and software platform for multimode 3G baseband designs. It is expected to be delivered during the first quarter of 2006 to customers in an easily integrated 'black box' format.

With up to five million available gates and 8.3Mbits of RAM, LSI Logic's RapidChip Integrator2 slice, the RC11Si390, will address TTPCom's need for fast time-to-market, high integration and high-speed performance. TTPCom will be embedding the high-performance ARM1156T2-S processor and will use the ARM1156T2-S processor reference design to further accelerate the production process.

Mike Casey, director of strategic marketing, LSI Logic Europe said that the technology involved in a multimode modem is highly complex. TTPCom's CBEmacro 3G presented a great opportunity to demonstrate the capabilities of the RapidChip Integrator2 slice architecture, such as flexible, diffused memory configurations with MatrixRAM memory. "The CBEmacro 3G technology takes full advantage of the comprehensive resources offered by the RapidChip Integrator2 family," added Casey.

Lastly, Warren East, CEO from ARM said that manufacturers need to focus on adding new and highly differentiated functionality in the shortest possible timescales, and this collaboration will help them do just that.

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