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ICI unveils latest back-end capabilities

Posted: 21 Sep 2005 ?? ?Print Version ?Bookmark and Share

Keywords:wafer test? laser marking? die singulation? reel?

IC Interconnect (ICI) has revealed that its wafer test, laser marking, die singulation, and tape and reel capabilities are now available as standard service offerings. The back-end services round out IC Interconnect's ability to offer a full turn-key solution as an integral part of the wafer bumping process. The equipment set gives ICI installed capacity to process about two million bumped die per week, making it a suitable arrangement for small to moderate volume processing of 100 to 500 wafers/week.

"Traditionally IC Interconnect has limited itself to the bumping niche. That meant after ICI bumped the wafers they were subsequently routed to other subcontractors for various additional operations. This created a significant challenge for our customers in terms of logistics, shipping costs, time delays and subcontractor qualification and management," explained Tony Gaines, ICI's regional sales manager.

A new automated optical inspection (AOI) system enables ICI to inspect wafers for bump height, yield and circuit defects as an independent service or as an integrated part of a customized process flow. Combining this data with an electronic wafer map allows for full wafer characterization.

In another new process, IC Interconnect uses a 532nm Nd:YAG laser to mark 100um to 200um diameter wafers. Wafers can be laser marked on the backside of each die with orientation marks, part numbers and traceable codes, in a variety of SEMI standard fonts. An optical character reader (OCR) system combined with previously generated wafer maps can be used to mark only known good die.

Wafers are then diced and placed into pocketed carrier tape. IC Interconnect's tape-and-reel equipment uses AOI systems to inspect all die for chip out, laser mark, and solder bump presence prior to placement into the carrier tape pockets, ensuring the highest quality levels are maintained.

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