Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Amplifiers/Converters
?
?
Amplifiers/Converters??

Schottky diodes shrink footprints by 80%, operate 40% cooler

Posted: 23 Sep 2005 ?? ?Print Version ?Bookmark and Share

Keywords:IR?

International Rectifier (IR) claims four new FlipKY Schottky diodes that are smaller and more efficient than industry-standard Schottky devices. Available in chip-scale packages (CSP), these new 0.5A and 1 devices are designed for applications such as current steering, ORing, boost and freewheeling circuits in handheld, portable equipment such as cell phones, MP3 players, PDAs and miniature hard disk drives where space is at a premium.

The new 30V IR0530CSP and 40V IR05H40CSP devices are housed in three-bump CSPs that occupy 1.1mm? of board space with a profile of less than 0.6mm. Compared to industry-standard SOD-123-packaged Schottky diodes, these new 0.5A FlipKY devices occupy 80 percent less board space and operate up to 40 percent cooler, according to the company.

The 30V IR130CSP and 40V - IR1H40CSP are 1A BGA devices, occupying 2.3mm? of board space, or about one third of the area consumed by a JEDEC DO-216AA package, while offering similar electrical and thermal performance.

The company said the FlipKY chip-scale packaging technology eliminates the lead frame, epoxy and mold compound traditionally used in other device packages and provides all electrical connections on one side of the silicon. Upshot: this design minimizes board space and device profile, but also reduces parasitic inductance.

As a result, in high-frequency switching applications, such as boost converters for LCD displays or LED drives, less parasitic inductance reduces voltage spikes and switching noise, which improves electrical efficiency and reduces EMI. The large bumps of the new 0.5A devices like the IR05H40CSP also serve as efficient heat conduction paths to the PC-board, enabling cooler operation than traditional leadframe devices. The packaging technology also enables the parts to be assembled with standard SMT techniques.

Pricing for the IR0530CSP and IR05H40CSP devices is 17 each in quantities of 10,000. The IR130CSP and IR1H40CSP devices are priced at 25 cents each in quantities of 10,000. The TR suffix indicates Tape and Reel (for example, IR0530CSPTR). Lead-free versions are available, designated by the suffix PbF (for example, IR0530CSPTRPbF). Prices are subject to change.

- Gina Roos

eeProductCenter



Article Comments - Schottky diodes shrink footprints by...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top