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Cadence, UMC develop reference design for wireless

Posted: 10 Oct 2005 ?? ?Print Version ?Bookmark and Share

Keywords:cadence? umc? Taiwan? foundry?

EDA supplier Cadence Design Systems Inc. and Taiwan-based semiconductor foundry UMC have announced a collaborative agreement to develop a comprehensive reference solution for complex wireless designs.

The jointly-developed reference solution, which will be based on the Cadence Virtuoso custom design platform and targets UMC's RFCMOS processes, will also include a reference design and other key technology from UMC.

Growing demand for analog/mixed-signal and RF devices for wireless applications, such as WLAN 802.11, UWB, and Bluetooth, is driving the need to integrate these various components into a single SoC and accelerate the path to wireless design. This new collaboration addresses these challenges by combining UMC's RFCMOS process technologies to deliver RF capabilities and Cadence's analog/mixed-signal and RF design tools and flow integration.

"Aggressive consumer demand for wireless products makes it critical for our customers to achieve silicon success quickly and meet market demand," said Patrick T. Lin, chief SoC architect, system and architecture support at UMC, in a statement. "By leveraging Cadence's Virtuoso platform with UMC's advanced manufacturing capabilities, we can provide a streamlined methodology for the design, simulation and integration of different components into complex SoCs used in wireless devices."

The reference design consists of Digital Baseband physical layer blocks, mixed-mode 1GHz AD/DA converter blocks, RF components, along with several pieces of enabling intellectual property (IP) from UMC. The companies plan to complete developing the reference flow over the next several months and then harden the design into silicon.

Customers will ultimately be able to access a complete wireless reference design package from UMC that includes the reference design, the design flow, compatible process design kit (PDK) and silicon-validation results from the reference design.

EE Times

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