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RF/Microwave??

Chipset targets millimeter wave apps

Posted: 25 Oct 2005 ?? ?Print Version ?Bookmark and Share

Keywords:mimix broadband? gallium arsenide? gaas? monolithic microwave integrated circuit? mmic?

Mimix Broadband Inc. announced the introduction of a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) 13GHz/15GHz chipset that consists of a highly integrated image reject receiver and transmitter, and compact, two stage power amplifier.

The image reject mixers eliminate the need for an image bandpass filter after the amplifier to remove thermal noise at the image frequency. Using 0.15?m gate length GaAs pseudomorphic high electron mobility transistor (phemt) device model technology, these devices achieve the following performance levels:

? Rx conversion gain: 13dB

? Rx Noise: 3dB

? Rx IIP3: 3dBm

? Tx conversion gain: 8dB

? Tx OIP3: -17dBm

The chipset is well suited for wireless communications applications such as millimeter-wave point-to-point radio, local multipoint distribution services (LMDS), SATCOM and VSAT applications.

"The receiver uses an image reject resistive 'cold fet' fundamental mixer to provide wide bandwidth and excellent intermodulation performance," said Dr. Jim Harvey, CTO of Mimix Broadband. "An image reject balanced mixer is used in the transmitter, or up-converter, to minimize spurious and ease filtering requirements before the up-converted signal is fed to the compact single ended PA. Linearity is suitable for the high order QAM modulation required in new radios to maximize spectrum usage. The useful bandwidth of the receiver and transmitter is 10GHz to 18GHz, flat from 11GHz to 17GHz, so they cover the commercial 13GHz and 15GHz bands and intermediate satellite bands."

Mimix performs 100 percent on-wafer RF and DC testing on these products, as well as 100 percent visual inspection to MIL-STD-883 method 2010. The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Engineering samples are already available.

- Janine Love

eeProductCenter





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