Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

IC Interconnect announces Ni/Au process qualification

Posted: 26 Oct 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ni/au process? ni/au pad resurfaceing? ic interconnect? wire bonding?

Wafer bumping service company, IC Interconnect has announced the qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications. The new process produces high-temperature stable bonds with a thinner gold layer. These wire bonds can be used in avionics and automotive apps, and does not require additional lead time for production.

The standard gold thickness that IC Interconnect uses is 0.1um while other companies use a gold thickness of at least 1um. "Many people don't believe that a thinner gold layer can hold up to the stress and abuse caused by their application," said Christine Jauernig, process engineer for IC Interconnect, in a statement. "Products made with our Ni/Au process have been tested and qualified by several customers."

Ni/Au pad resurfacing also provides other advantages for copper-based ICs. Because Ni/Au plating on copper pads is maskless, costs are reduced from thin film sputter, photolithography and metal etch.

"Electroless Ni/Immersion Au is an inexpensive method to enable standard gold wire bonding to be extended to the thermal demands (200 C) required of today's state-of-the-art electronics," said IC Interconnect president, Curt Erickson.

Article Comments - IC Interconnect announces Ni/Au proc...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top