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Winbond borrows $440 million for fab expansion

Posted: 27 Oct 2005 ?? ?Print Version ?Bookmark and Share

Keywords:winbond? fab? taiwan? 300mm? wafer?

Winbond Electronics Corp. has signed a five-year syndicated loan for NT$15 billion (about $440 million) to fund 300-mm wafer fab expansion at the Central Taiwan Science Park.

The current monthly production capacity is 8,000 wafers the loan should allow Winbond to expand production smoothly to 16,000 wafers per month by the end of 2006. By 2007, the wafer fab's output is scheduled to reach 24,000 wafers per month, Winbond (Hsinchu, Taiwan) said. The loan team was led by Bank of Taiwan, China Trust Commercial Bank, Taipei Fubon Bank, ABN AMRO Bank and First Commercial Bank and consisted of other seventeen financial institutions.

Winbond, a maker of logic and memory ICs, said it is trying to position itself as a vendor of silicon for mobile applications.

- Peter Clarke

EE Times

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