Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

Die, package design get closer

Posted: 01 Nov 2005 ?? ?Print Version ?Bookmark and Share

Keywords:synopsys? jupiterio? floorplanning analysis tool? die? package?

Targeting designs headed for flip-chip packages, Synopsys Inc. introduced JupiterIO, a floorplanning and analysis tool that enables concurrent die and package design flows.

JupiterIO takes its place in what Synopsys product marketing manager Kevin Reingold called "the DFA, or design-for-assembly, space" within the better-known DFM field. As chip designs move from wire-bonded packages to flip-chip packages with a thousand or more conductive bumps serving as I/Os, design teams require tools for concurrent development of the die and package. "In three to five years, projections call for SoCs to have as many as 4,000 I/Os," Reingold said. "That means die and packaging engineers will have higher levels of interdependency."

Getting the I/Os on the die to the correct bumps on the package is a complex task and some ASIC vendors have developed internal tools to automate the job. Those companies are now looking to Synopsys to provide commercially available software, Reingold said.

When it debuts at the Synopsys Users Group meeting, JupiterIO will take its place alongside the JupiterXT floorplanning tool within the Synopsys Galaxy design platform, which Reingold said takes design teams "from rtl to gdsii" using the Milkyway database. JupiterIO supports the Milkyway data and packaging database formats. Reingold said the tool is suited to "package-influenced flows that can go through dozens of iterations, which creates the need for a design-planning tool that allows the die and packaging groups to coexist."

JupiterIO provides the engineering groups with a concurrent view of the die and package, and provides constraints that are both die- and package-aware. That allows the two groups to make concurrent decisions on implementation.

The tool supports simultaneous place-and-route of the bumped I/Os and uses a pattern-based approach that is correct-by-construction, shortening the time needed to select the correct packaging, according to Synopsys.

JupiterIO sells for $200,000 for a perpetual license.

- David Lammers

EE Times

Article Comments - Die, package design get closer
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top