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Rogers displays new lines of adhesiveless, API circuit materials

Posted: 09 Nov 2005 ?? ?Print Version ?Bookmark and Share

Keywords:rogers? 2l-fccl? circuit material?

Rogers Corp. disclosed that it will be showcasing its two new lines of 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cellphone hinge flex, LCD interconnection and other applications at next week's Productronica in Munich, Germany.

Offerings include Rogers R/flex AP 200 material, a single-clad, cast-on type product; and Mitsui Chemicals NEOFLEX NFX material, a double-clad, laminated-type product. Both products are available in rolls of 250mm and 500mm wide.

The new adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil without the use of conventional adhesives. Since these laminates are manufactured without the use of adhesives, they are designed for the manufacturing of circuits intended for use in high-density designs, harsh working environments, dynamic flexing applications as well as thin multilayer and rigid-flex circuits.

Other product features and benefits include:

? Excellent solder resistance, ideal for Pb-free soldering temperatures;

? Thinner cross-section than laminates with adhesives, allowing smaller bend radius and high cycles in hinged applications;

? Inherently flame-resistant, halogen-free (green) with a flammability rating of UL 94V-0; and

? Excellent dimensional stability, for use in making fine line flexible circuit designs and assemblies.

These materials are compatible with the company's other fine R/flex adhesive-based materials and covercoats. Other products to be featured at the show will include Rogers' full range of RT/duroid products, as well as R/flex Crystal Flexible Circuit Materials.

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