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M-Systems, Infineon sign supply agreement

Posted: 18 Nov 2005 ?? ?Print Version ?Bookmark and Share

Keywords:infineon? m-systems? dram? diskonchip? mcp?

M-Systems and Infineon Technologies AG have signed an agreement on the supply of low-power mobile-ram for mobile devices.

The agreement calls for Infineon to supply Known Good Dies (KGDs) for M-Systems' DiskOnChip-based multi-chip package devices aimed at multimedia mobile applications. Infineon will do all functional and quality testing of the dies on the finished wafer before they are stacked with M-Systems' non-volatile data storage devices.

"MCP packaging is becoming mainstream in handsets as they become smaller, and we see our MCP business growing to meet that trend," said M-Systems vice president and general manager for mobile division, David Tolub, in a statement. "Our agreement with Infineon, a leader in the Mobile-RAM KGD business, augments our supply capabilities and further strengthens the DiskOnChip multiple source strategy."

With handsets becoming smaller and consumers demanding more multimedia capabilities, use of MCP devices is also becoming important. The Mobile-RAM complements M-Systems' DiskOnChip technology based on NAND flash. This combination tackles the growing memory demand from high bandwidth cellular standards such as W-CDMA, EDGE, HSDPA and UMTS.

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