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Manufacturing/Packaging??

New QFN/DFN package from AIT

Posted: 23 Nov 2005 ?? ?Print Version ?Bookmark and Share

Keywords:Advanced Interconnect Technologies? ait? QFN? DFN? package?

Advanced Interconnect Technologies (AIT) announced the availability of a new ultra-thin QFN/DFN package that features a package thickness of 0.60mm, making it a suitable solution for todays ever shrinking consumer electronics. According to AIT, the lower profile allows for board space reduction, package efficiency in the z-direction, shorter electrical paths for increased power yield, and overall system weight reduction.

"The amount of real estate in consumer electronics continues to provide design challenges," shared AIT CEO Bruno Guilmart. "With this new package technology, we can accommodate the needs of smaller and power restricted handheld PDAs, video cameras, smart cards and other devices."

The press release explained that the thickness of the uQFN/DFN package has been reduced directly from the leadframe, allowing a larger die thickness. Since the die thickness is not reduced as dramatically, the die will experience less stress and better reliability performance, said AIT. And since the package will utilize the existing assembly infrastructure, it is expected to have better yield compared to thinner dies.

The QFN package family is available in a green material set that is fully compliant with the European Commission, U.S. Environmental Protection Agency and Japan's Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent, chromium and PBB PBDE chemicals. The fully qualified uQFN/DFN package is already available in full production volumes.




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