Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Malaysia's Unisem plans expansion in 2006

Posted: 24 Nov 2005 ?? ?Print Version ?Bookmark and Share

Keywords:malaysia? Singapore? unisem? ipoh?

Malaysian chip maker Unisem is set to expand its reach in early 2006 by launching a new bumping joint venture at its main site in Ipoh and commencing operations at a test and assembly plant in Chengdu, China, a company executive said.

Ruth Chin, Unisem's senior manager for corporate affairs said the 20,000-square-foot wafer bumping plant, part of a joint venture with Singapore's Advanpack Solutions, will require total investments of $11.6 million over the next three years but could ease Unisem's entry into new business lines.

"Wafer bump and advanced packaging capabilities will allow Unisem to position itself in the high growth markets for flip-chip and wafer-level packaging," Chin said. "With [Unisem and Advanpack] located on the same site, Unisem can offer full turnkey flip-chip packaging solutions."

The facility is expected to enter commercial production in the first quarter of 2006 with an initial capacity of about 5,000 wafers per month.

Unisem is simultaneously putting the finishing touches on a 320,000-square-foot assembly and test plant in Chengdu. Chin said construction should be completed by the end of 2005, and commercial production is set to begin in early 2006. Unisem will spend about $20 million on the facility this year, primarily on construction.

Unisem is the second largest chip maker in Malaysia after market leader Malaysian Pacific Industries, registering some $146 million in sales in 2004.

- Jonathan Hopfner
EE Times

Article Comments - Malaysia's Unisem plans expansion in...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top