Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Elpida beefs up 300mm wafer fab in Hiroshima

Posted: 05 Dec 2005 ?? ?Print Version ?Bookmark and Share

Keywords:Elpida Memory? Hiroshima Elpida Memory? 300mm? production line? wafer fabrication?

Elpida Memory Inc. and Hiroshima Elpida Memory Inc. (Hiroshima Elpida) announced the completion of its new 300mm production line at its 300mm wafer fabrication facility (E300 Fab) in Hiroshima, Japan.

The monthly 300mm wafer production volume is expected to reach a capacity of 54,000 by FY Q4. According to the press release, this would make Hiroshima Elpida's E300 Fab the largest semiconductor wafer processing capacity in Japan.

Construction of the facility that now houses the expanded line began in June 2004, and was completed in June 2005. This was followed by the installation of clean rooms and production equipment and several test-runs of factory operations. In FY Q2, the E300 Fab started with an average of 30,000 wafers per month, increasing to 45,000 wafers per month by November 2005. This month (December 2005), volume is expected to increase to 50,000 wafers per month.

"Our initial ramp has been extremely smooth and successful, and each day we are seeing an increase in the number of wafers processed," said Shuichi Otsuka, president of Hiroshima Elpida.

Article Comments - Elpida beefs up 300mm wafer fab in H...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top