Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Casio uses Semitool's Raider tool for Pb-free electroplating apps

Posted: 07 Dec 2005 ?? ?Print Version ?Bookmark and Share

Keywords:Semitool? wafer deposition? wafer? electroplating? Raider tool?

Semitool Inc., a manufacturer of advanced single-wafer deposition and surface preparation process equipment for the semiconductor and wafer-level packaging industry, announced the delivery of a follow-on order for its electroplating Raider tool by Japan-based Casio Micronics Co. Ltd. Casio will use the Raider for advanced Pb-free electroplating applications.

"Wafer-level packaging, specifically in lead-free applications, is one of the fastest growing segments in semiconductor packaging today," said Dan Schmauch, director of advanced packaging at Semitool. "Casio, being one of the leaders in Pb-free packaging, now has added advanced Pb-free electroplating technology and production capacity from Semitool. Casio has always been at the forefront of cost-effective packaging solutions and we at Semitool are proud to be a supplier of equipment in their wafer-level packaging line."

Casio President Noriyuki Kakihisa commented, "Our successful use of Semitool Raider plating tools has played an important role in our development of 300mm and Pb-free wafer-level packaging."

Wafer-level packaging is a technology that builds chip interconnect bumps on the entire wafer before singulation, and is used as an alternative to wire bonding. High-volume wafer processing equipment allows for greater precision and facilitates smaller and higher density interconnects.

Article Comments - Casio uses Semitool's Raider tool fo...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top