Casio uses Semitool's Raider tool for Pb-free electroplating apps

Semitool Inc., a manufacturer of advanced single-wafer deposition and surface preparation process equipment for the semiconductor and wafer-level packaging industry, announced the delivery of a follow-on order for its electroplating Raider tool by Japan-based Casio Micronics Co. Ltd. Casio will use the Raider for advanced Pb-free electroplating applications.

"Wafer-level packaging, specifically in lead-free applications, is one of the fastest growing segments in semiconductor packaging today," said Dan Schmauch, director of advanced packaging at Semitool. "Casio, being one of the leaders in Pb-free packaging, now has added advanced Pb-free electroplating technology and production capacity from Semitool. Casio has always been at the forefront of cost-effective packaging solutions and we at Semitool are proud to be a supplier of equipment in their wafer-level packaging line."

Casio President Noriyuki Kakihisa commented, "Our successful use of Semitool Raider plating tools has played an important role in our development of 300mm and Pb-free wafer-level packaging."

Wafer-level packaging is a technology that builds chip interconnect bumps on the entire wafer before singulation, and is used as an alternative to wire bonding. High-volume wafer processing equipment allows for greater precision and facilitates smaller and higher density interconnects.